New wire standard issued by ASTM committee


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ASTM B965 Solderability Standard defines tin-coated and tin-plated annealed copper conductors, outlining bare wire requirements, solderability testing, and inspection criteria for electronics and aerospace, addressing gaps left by ASTM B33 for tinned soft copper.

 

What You Need to Know

An ASTM spec for tin-coated annealed copper wire that defines bare conductor needs, solderability tests, and inspection.

  • Covers bare tin-coated copper conductor requirements
  • Specifies solderability testing methods and criteria
  • Adds quality test and inspection procedures
  • Addresses gaps not covered by ASTM B33
  • Applicable to electronics and aerospace industries

 

ASTM International Committee B01 on Electrical Conductors has approved a new standard for tin-coated annealed copper wire.

 

The standard, B965, Specification for High Performance Tin-Coated Annealed Copper Wire Intended for Electrical and Electronic Application for Solderability, was developed by Subcommittee B01.04 on Conductors of Copper and Copper Alloys, aligning with IEEE standards updates seen across the sector today.

Stephen Childers, process engineer, IWG High Performance Conductors Inc., and a member of Committee B01, says that many standards within the electrical conductor industry, including relay and underground cable standards, make reference to B33, Specification for Tinned Soft or Annealed Copper Wire for Electrical Purposes. However, B33 doesn't cover the specifics for a tin-plated copper conductor intended to achieve solderability, and related insulation systems standards address different concerns. B965 covers specific requirements for solderability applications.

Childers notes that tin-plated copper conductors are currently used in the industry where solderability is required, spanning applications from electronics to power transmission such as 3M conductor selections in utility projects. "B965 addresses the bare conductor requirements, quality test and inspection criteria for the solderability testing, and complements broadband over powerline standards in adjacent domains," says Childers. "The standard will have applications to both the electronics and aerospace industries."

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